Anabond 653 Heat Sink Compound is a heat transfer compound that is formulated with polydimethyl siloxanee fluids in combination with metallic oxide fillers to provide superior thermal conductivity. It is designed for use as a heat transfer compound in both the electrical, and the electronic industries, and is characterized by its high thermal conductivity, high dielectric constant, and high dissipation factor. Anabond HS653 is an ideal material for use in thermocouples, power diodes, transistors, semi-conductors, etc. Anabond HS653 exhibits excellent long-term storage stability, without oil separation.