Alpha CVP-520 Solder Paste is designed to enable low temperature surface mount assembly technology. The lead-free alloy in Alpha CVP-520 Solder Paste has a melting point below 140°C, and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux residue from Alpha CVP-520 Solder Paste is clear, colorless, and provides excellent electrical resistivity, exceeding industry standards. This product enables the elimination of an extra wave or selective wave soldering process when temperature sensitive through hole components are used in an assembly. Eliminating a wave soldering or selective soldering step can significantly lower the cost of producing an electronic assembly, increase daily throughput, eliminate the need for managing bar solder and wave soldering flux supplies and eliminate the need for pallets.