Alpha OM-338 Solder Paste is a lead-free, no-clean solder paste designed for a broad range of applications. Alpha OM-338’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process. Alpha OM-338 yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high throughput applications.